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| RF3220 0 RoHS Compliant & Pb-Free Product Typical Applications * Basestation Applications * Cellular and PCS Systems * CDMA, W-CDMA Systems Product Description The RF3220 is a high-efficiency GaAs Heterojunction Bipolar Transistor (HBT) amplifier packaged in a low-cost surface-mount package. This amplifier is ideal for use in applications requiring high-linearity and low noise figure over the 500MHz to 3GHz frequency range. The RF3220 operates from a single 5V power supply, and is assembled in an economical 3mmx3mm QFN package. -A2 PLCS 0.10 C A HIGH LINEARITY/DRIVER AMPLIFIER * GSM/EDGE Systems * Final PA for Low-Power Applications 2 PLCS 0.05 C 3.00 0.10 C B 2 PLCS 0.70 0.65 0.90 0.85 0.05 0.00 3.00 12 MAX 2 PLCS 0.10 C B 2.75 SQ. 0.10 C A 2 PLCS -B- Dimensions in mm. -C- SEATING PLANE Shaded lead is pin 1. 0.10 M C A B 0.60 0.24 TYP 0.30 0.18 PIN 1 ID R.20 0.75 0.50 1.25 0.95 SQ. 0.50 Optimum Technology Matching(R) Applied Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS Package Style: QFN, 12-Pin, 3x3 Features * 500MHz to 2GHz * +40.8dBm Output IP3 * +14.2dB Gain at 1850MHz BIAS GND GND * +12.4dBm Input P1dB at 1850MHz * 2.8dB Noise Figure at 1850MHz 9 GND 8 RF OUT 7 GND 12 GND 1 RF IN 2 GND 3 4 GND 11 10 * Single 5V Power Supply 5 GND 6 GND Ordering Information RF3220 High Linearity/Driver Amplifier RF3220PCBA-41XFully Assembled Evaluation Board Functional Block Diagram RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Rev A1 050822 4-537 RF3220 Absolute Maximum Ratings Parameter RF Input Power Device Voltage Device Current Operating Temperature Storage Temperature Rating +20 -0.5 to +6.0 250 -40 to +85 -40 to +150 Unit dBm V mA C C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. RoHS marking based on EUDirective2002/95/EC (at time of this printing). However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Parameter Overall AC Specifications Frequency Gain Input VSWR Output VSWR Reverse Isolation Output IP3 Output P1dB Noise Figure Min. Specification Typ. Max. Unit Condition VCC =5V, RFIN =-10dBm, Freq=1850MHz, with Temp=25C unless otherwise noted. 500 12 20 36 23 14.2 1.2 1.7 23 40 +25.5 2.9 76 153 2000 15.5 1.5 2.0 MHz dB SWR SWR dBm dBm dB C/W C F1 = 1850MHz, F2 =1851MHz 3.3 Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failures ICC =160mA, PDISS =0.997W. (See Note.) TCASE =+85C TCASE =+85C 5800 years DC Specifications Device Voltage 4.5 5.0 5.5 V ICC =160mA Operating Current Range 110 145 170 mA VCC =5V Note: The RF3220 must be operated at or below 175mA in order to achieve the thermal performance listed above. While the RF3220 may be operated at higher bias currents, 175mA is the recommended bias to ensure the highest possible reliability and electrical performance. 4-538 Rev A1 050822 RF3220 Pin 1 2 Function GND RF IN Description Ground connection. RF input pin. This pin is not internally DC-blocked. A DC blocking capacitor suitable for the frequency of operation should be used. To Bias Circuit RF OUT RF IN Interface Schematic 3 4 5 6 7 8 GND GND GND GND GND RF OUT Ground connection. Ground connection. Ground connection. Ground connection. Ground connection. Amplifier output pin. This pin is an open-collector output. It must be biased to VCC through a choke or matching inductor. This pin is typically matched to 50 with a shunt bias/matching inductor and series blocking/matching capacitor. Refer to application schematics. Ground connection. Ground connection. This pin is used to control the bias current. An external resistor may be used to set the bias current for any VPD voltage. Allows for trade-offs between IP3 versus noise figure and TMAX. VCC See pin 2. 9 10 11 GND GND BIAS 12 Pkg Base GND GND Ground connection. Ground connection. Vias to ground required under the package base. Rev A1 050822 4-539 RF3220 Application Schematic - 1850MHz VCC 240 12 1 3 pF RF IN 2.2 nH 2 3 4 11 10 9 8 2.2 pF 7 10 nH RF OUT 4.7 nH 5 6 4-540 Rev A1 050822 RF3220 Evaluation Board Schematic BIAS VCC + C8 4.7 F C6 10 pF C5 0.1 F R1 240 C3 10 pF 9 8 7 4 5 6 L3 4.7 nH P1 P1-1 1 2 P1-3 3 CON3 BIAS GND VCC L2 10 nH C4 0.1 F C7 + 4.7 F 12 C1 3 pF L1 2.2 nH 1 2 3 11 10 J1 RF IN 50 strip C2 2.2 pF 50 strip J2 RF OUT Rev A1 050822 4-541 RF3220 Evaluation Board Layout Board Size 1.5" x 1.5" Board Thickness 0.032", Board Material FR-4 4-542 Rev A1 050822 RF3220 ICC versus VCC Across Temperature 210.00 -40C 25C 85C 14.0 16.0 -40C 25C 85C Gain versus Frequency Across Temperature (VCC=5.0V) 190.00 170.00 150.00 130.00 Gain (dB) 4.25 4.50 4.75 5.00 5.25 5.50 5.75 6.00 12.0 ICC (mA) 110.00 10.0 90.00 8.0 70.00 50.00 4.00 6.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 VCC (V) Frequency (MHz) OIP3 versus Frequency Across Temperature 44.0 43.0 42.0 41.0 40.0 25.0 -40C 25C 85C Output P1dB versus Frequency Across Temperature 26.0 -40C 25C 85C (VCC=5.0V) (VCC=5.0V) 39.0 38.0 37.0 36.0 35.0 34.0 33.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 Output P1dB (dBm) Frequency (MHz) OIP3 (dBm) 24.0 23.0 22.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 Frequency (MHz) Input SWR versus Frequency Across Temperature 6.0 -40C 25C 85C 5.0 2.5 Output VSWR versus Frequency Across Temperature 3.0 -40C 25C 85C (VCC=5.0V) (VCC=5.0V) 4.0 VSWR 3.0 2.0 1.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 SWR 2.0 1.5 1.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 Frequency (MHz) Frequency (MHz) Rev A1 050822 4-543 RF3220 Noise Figure versus Frequency Across Temperature 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 1300.0 1400.0 1500.0 1600.0 1700.0 1800.0 1900.0 2000.0 2100.0 2200.0 2300.0 -40C 25C 85C (VCC=5.0V) Noise Figure (dB) Frequency (MHz) 4-544 Rev A1 050822 RF3220 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.90 x 0.28 (mm) Typ. B = 0.28 x 0.90 (mm) Typ. C = 1.10 (mm) Sq. 1.00 Typ. 0.50 Typ. B Pin 1 B B Dimensions in mm. A 0.50 Typ. A A 0.77 Typ. B B B C A 0.50 A A 1.00 Typ. 0.77 Typ. 0.50 (mm) Figure 1. PCB Metal Land Pattern (Top View) PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. Thermal Pad and Via Design The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Rev A1 050822 4-545 RF3220 A = 1.00 x 0.38 (mm) Typ. B = 0.38 x 1.00 (mm) Typ. C = 1.20 (mm) Sq. 1.00 Typ. 0.50 Typ. B Pin 1 B B Dimensions in mm. A 0.50 Typ. A A 0.77 Typ. B B B C A 0.50 A A 1.00 Typ. 0.77 Typ. 0.50 Figure 2. PCB Solder Mask Pattern (Top View) 4-546 Rev A1 050822 |
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